BZX84C3V3

3.3V,350mW Surface mount Diode-Zener Single: Standard

Case Type: SOT-23

Forward Voltage (VF)
900 mV
Junction Temperature (Tj)
-65 — 150 °C
Maximum Temperature Coefficient (ΘVZ)
-0.06 %/°C
Maximum Zener Current (IZM)
76 mA
Power Dissipation (PD)
350 mW
Reverse Voltage Leakage Current (IR)
5 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W
Zener Impedance (ZZT)
95 Ω
Zener Knee Impedance (ZZK)
600 Ω
Zener Voltage (VZ)
3.1 — 3.5 V

(3.3 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
BZX84C3V3 BK Box@3,500 Active 3.3V,350mW Surface mount Diode-Zener Single: Standard EAR99 8541.10.0050 PBFREE
BZX84C3V3 TR Tape & Reel@3,000 Active 3.3V,350mW Surface mount Diode-Zener Single: Standard EAR99 8541.10.0050 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
BZX84C3V3-33.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:All Switching, Schottky and Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Process Change Notice:CPZ18 REPLACED WITH CPZ28X Process Change Notice
Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Step File 3D Object:SOT-23 Step File 3D Object