Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 10 mA
Test Conditions
VR = 1 V
Test Conditions
IZT = 5 mA
Test Conditions
IZT = 5 mA
(3.3 V Typical)
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMDZ3V3 BK | Box@5,000 | End Of Life | 3.3V,250mW Surface mount Diode-Zener Single: Standard | EAR99 | 8541.10.0050 | PBFREE | |
| CMDZ3V3 TR | Tape & Reel@3,000 | End Of Life | 3.3V,250mW Surface mount Diode-Zener Single: Standard | EAR99 | 8541.10.0050 | TIN |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Lead frame | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMDZ2V4_SERIES.PDF | Device Datasheet |
| Material Composition:SOD-323 | Material Composition |
| Package Detail Document:SOD-323 | Package Detail Document |
| Process Change Notice:CPZ18 REPLACED WITH CPZ28X | Process Change Notice |
| Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X | Process Change Notice |
| Product EOL Notice:All P/Ns in the SOD-323 case | Product EOL Notice |
| Product Reliability Data:SOD-323 Package Reliability | Product Reliability Data |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development