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CMDZ5V1

5.1V,250mW Surface mount Diode-Zener Single: Standard

Case Type: SOD-323

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Technical Specifications

Similar Products with Selected Specifications
Forward Voltage (VF)
900 mV
Junction Temperature (Tj)
-65 — 175 °C
Power Dissipation (PD)
250 mW
Reverse Voltage Leakage Current (IR)
2 µA
Storage Temperature (Tstg)
-65 — 175 °C
Zener Impedance (ZZT)
60 Ω
Zener Voltage (VZ)
4.85 — 5.36 V

(5.1 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMDZ5V1 BK Box@5,000 End Of Life 5.1V,250mW Surface mount Diode-Zener Single: Standard EAR99 8541.10.0050 PBFREE
CMDZ5V1 TR Tape & Reel@3,000 End Of Life 5.1V,250mW Surface mount Diode-Zener Single: Standard EAR99 8541.10.0050 TIN

Resources

Item Type
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Lead frame Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMDZ2V4_SERIES.PDF Device Datasheet
Material Composition:SOD-323 Material Composition
Package Detail Document:SOD-323 Package Detail Document
Process Change Notice:CPZ18 REPLACED WITH CPZ28X Process Change Notice
Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X Process Change Notice
Product EOL Notice:All P/Ns in the SOD-323 case Product EOL Notice
Product Reliability Data:SOD-323 Package Reliability Product Reliability Data
Spice Model:Spice Model CMDZ5V1 Spice Model

Product Support

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  • Consolidated shipping options
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Design Support

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We provide the highest level of support to insure product is delivered on-time:

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • Custom electrical curves
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development