CMKZ5232B

5.6V,200mW Surface mount Diode-Zener Triple: Isolated

Case Type: SOT-363

Forward Voltage (VF)
900 mV
Junction Temperature (Tj)
-65 — 150 °C
Maximum Temperature Coefficient (ΘVZ)
0.038 %/°C
Power Dissipation (PD)
200 mW
Reverse Voltage Leakage Current (IR)
5 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
625 °C/W
Zener Impedance (ZZT)
11 Ω
Zener Knee Impedance (ZZK)
1600 Ω
Zener Voltage (VZ)
5.32 — 5.88 V

(5.6 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMKZ5232B BK Box@5,000 Discontinued 5.6V,200mW Surface mount Diode-Zener Triple: Isolated EAR99 8541.10.0050 PBFREE
CMKZ5232B TR Tape & Reel@3,000 Discontinued 5.6V,200mW Surface mount Diode-Zener Triple: Isolated EAR99 8541.10.0050 PBFREE

Resources

Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMKZ5221B_SERIES.PDF Device Datasheet
Material Composition:SOT-363 Material Composition
Package Detail Document:SOT-363 Package Detail Document
Process Change Notice:CPZ18 REPLACED WITH CPZ28X Process Change Notice
Product EOL Notice:CMKZ5221B Product EOL Notice
Product Reliability Data:SOT-363 Package Reliability Product Reliability Data
Step File 3D Object:SOT-363 (SC-88) Step File 3D Object

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development