CMLZDA3V3

3.3V,250mW Surface mount Diode-Zener Dual: Common Anode

Case Type: SOT-563

Forward Voltage (VF)
900 mV
Junction Temperature (Tj)
-65 — 150 °C
Maximum Temperature Coefficient (ΘVZ)
-0.06 %/°C
Maximum Zener Current (IZM)
47 mA
Power Dissipation (PD)
250 mW
Reverse Voltage Leakage Current (IR)
5 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
500 °C/W
Zener Impedance (ZZT)
95 Ω
Zener Knee Impedance (ZZK)
600 Ω
Zener Voltage (VZ)
3.1 — 3.5 V

(3.3 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMLZDA3V3 BK Box@5,000 Discontinued 3.3V,250mW Surface mount Diode-Zener Dual: Common Anode EAR99 8541.10.0050 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMLZDA2V4_SERIES.PDF Device Datasheet
Material Composition:SOT-563 Material Composition
Package Detail Document:SOT-563 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOT-563 Process Change Notice
Process Change Notice:CPZ18 REPLACED WITH CPZ28X Process Change Notice
Process Change Notice:SOT-563 Alternate Lead Frame Process Change Notice
Product EOL Notice:SOT-563 OPTION2 Product EOL Notice
Product Reliability Data:SOT-563 Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development