CMOZ3V3

3.3V,350mW Surface mount Diode-Zener Single: Standard

Case Type: SOD-523

Forward Voltage (V_F)

900 mV

Junction Temperature (T_j)

-65 — 150 °C

Power Dissipation (P_D)

350 mW

Power Dissipation (P_D)

300 mW

Power Dissipation (P_D)

250 mW

Reverse Voltage Leakage Current (I_R)

2 µA

Storage Temperature (T_stg)

-65 — 150 °C

Thermal Resistance Junction-Ambient (Θ_JA)

417 °C/W

Zener Impedance (Z_ZT)

95 Ω

Zener Voltage (V_Z)

3.14 — 3.47 V

(3.3 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CMOZ3V3 BK	Box@5,000		Active	3.3V,350mW Surface mount Diode-Zener Single: Standard	EAR99	8541.10.0050	TIN
CMOZ3V3 TR	Tape & Reel@3,000		Active	3.3V,350mW Surface mount Diode-Zener Single: Standard	EAR99	8541.10.0050	TIN


Item	Type
No matching documents found.
Analytical Test Report:Alloy 42 leadframe	Analytical Test Report
Analytical Test Report:Copper Bond Wire	Analytical Test Report
Analytical Test Report:Gold Bond Wire	Analytical Test Report
Analytical Test Report:Gold Bond Wire	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Leadframe	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
CMOZ2V4_SERIES.PDF	Device Datasheet
Material Composition:SOD-523	Material Composition
Package Detail Document:SOD-523	Package Detail Document
Process Change Notice:Copper Wire Bonding - SOD-523	Process Change Notice
Process Change Notice:CPZ18 REPLACED WITH CPZ28X	Process Change Notice
Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X	Process Change Notice
Product Reliability Data:SOD-523 Package Reliability	Product Reliability Data