CMOZ9V1C

9.1V,350mW Surface mount Diode-Zener Single: Standard Tight Tolerance

Case Type: SOD-523

Forward Voltage (VF)
900 mV
Junction Temperature (Tj)
-65 — 150 °C
Power Dissipation (PD)
350 mW
Power Dissipation (PD)
300 mW
Power Dissipation (PD)
250 mW
Reverse Voltage Leakage Current (IR)
0.5 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
417 °C/W
Zener Impedance (ZZT)
15 Ω
Zener Voltage (VZ)
8.92 — 9.28 V

(9.1 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMOZ9V1C BK Box@5,000 Discontinued, Stock Only 9.1V,350mW Surface mount Diode-Zener Single: Standard Tight Tolerance EAR99 8541.10.0050 PBFREE

Resources

Analytical Test Report:Alloy 42 leadframe Analytical Test Report
Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Die Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMOZ2V4C_SERIES.PDF Device Datasheet
Material Composition:SOD-523 Material Composition
Package Detail Document:SOD-523 Package Detail Document
Process Change Notice:Copper Wire Bonding - SOD-523 Process Change Notice
Process Change Notice:CPZ19 REPLACED WITH CPZ28 Process Change Notice
Product Reliability Data:SOD-523 Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development