CMPZ4685

3.6V,350mW Surface mount Diode-Zener Single: Low Level

Case Type: SOT-23

Forward Voltage (VF)
1.5 V
Junction Temperature (Tj)
-65 — 150 °C
Maximum Zener Current (IZM)
75 mA
Power Dissipation (PD)
350 mW
Reverse Voltage Leakage Current (IR)
7.5 µA
Storage Temperature (Tstg)
-65 — 150 °C
Zener Impedance (ZZT)
50 Ω
Zener Knee Impedance (ZZK)
2050 Ω
Zener Voltage (VZ)
3.42 — 3.78 V

(3.6 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMPZ4685 BK Box@3,500 Active 3.6V,350mW Surface mount Diode-Zener Single: Low Level EAR99 8541.10.0050 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMPZ4678-717.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:0.35W ZENER Process Change Notice
Process Change Notice:All Switching, Schottky and Process Change Notice
Process Change Notice:Copper Wire Bonding Process Change Notice
Process Change Notice:CPZ18 REPLACED WITH CPZ28X Process Change Notice
Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X Process Change Notice
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Step File 3D Object:SOT-23 Step File 3D Object

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development