CMSZ5221B

2.4V,275mW Surface mount Diode-Zener Single: Standard

Case Type: SOT-323

Forward Voltage (VF)
900 mV
Junction Temperature (Tj)
-65 — 150 °C
Maximum Temperature Coefficient (ΘVZ)
-0.085 %/°C
Power Dissipation (PD)
275 mW
Reverse Voltage Leakage Current (IR)
100 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
455 °C/W
Zener Impedance (ZZT)
30 Ω
Zener Knee Impedance (ZZK)
1200 Ω
Zener Voltage (VZ)
2.28 — 2.52 V

(2.4 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMSZ5221B BK Box@5,000 Active 2.4V,275mW Surface mount Diode-Zener Single: Standard EAR99 8541.10.0050 PBFREE
CMSZ5221B TR Tape & Reel@3,000 Active 2.4V,275mW Surface mount Diode-Zener Single: Standard EAR99 8541.10.0050 LEAD or TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Gold Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Leadframe Analytical Test Report
Analytical Test Report:Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
CMSZ5221B-61B.PDF Device Datasheet
Material Composition:SOT-323 Material Composition
Package Detail Document:SOT-323 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Process Change Notice:CPZ18 REPLACED WITH CPZ28X Process Change Notice
Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X Process Change Notice
Product Reliability Data:SOT-323 Package Reliability Product Reliability Data
Step File 3D Object:SOT-323 (SC-70) Step File 3D Object