CMSZ5244B

14V,275mW Surface mount Diode-Zener Single: Standard

Case Type: SOT-323

Forward Voltage (V_F)

900 mV

Junction Temperature (T_j)

-65 — 150 °C

Maximum Temperature Coefficient (ΘV_Z)

0.082 %/°C

Power Dissipation (P_D)

275 mW

Reverse Voltage Leakage Current (I_R)

0.1 µA

Storage Temperature (T_stg)

-65 — 150 °C

Thermal Resistance Junction-Ambient (Θ_JA)

455 °C/W

Zener Impedance (Z_ZT)

15 Ω

Zener Knee Impedance (Z_ZK)

600 Ω

Zener Voltage (V_Z)

13.3 — 14.7 V

(14 V Typical)

Part	Package	Buy	Status	Description	ECCN Code	HTS Code	Termination
CMSZ5244B BK	Box@5,000		Active	14V,275mW Surface mount Diode-Zener Single: Standard	EAR99	8541.10.0050	TIN
CMSZ5244B TR	Tape & Reel@3,000		Active	14V,275mW Surface mount Diode-Zener Single: Standard	EAR99	8541.10.0050	LEAD or TIN


Item	Type
No matching documents found.
Analytical Test Report:Copper Bond Wire	Analytical Test Report
Analytical Test Report:Gold Bond Wire	Analytical Test Report
Analytical Test Report:Gold Bond Wire	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Halogen Epoxy Molding Compound	Analytical Test Report
Analytical Test Report:Leadframe	Analytical Test Report
Analytical Test Report:Leadframe	Analytical Test Report
Analytical Test Report:Molding Compound	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
Analytical Test Report:Sn Plating	Analytical Test Report
CMSZ5221B-61B.PDF	Device Datasheet
Material Composition:SOT-323	Material Composition
Package Detail Document:SOT-323	Package Detail Document
Process Change Notice:Copper Wire Bonding	Process Change Notice
Process Change Notice:CPZ19 REPLACED WITH CPZ28	Process Change Notice
Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X	Process Change Notice
Product Reliability Data:SOT-323 Package Reliability	Product Reliability Data
Step File 3D Object:SOT-323 (SC-70)	Step File 3D Object