CZ5347C

10V,5W Through-Hole Diode-Zener Single: Power Tight Tolerance

Case Type: DO-201

Forward Voltage (VF)
1.2 V
Junction Temperature (Tj)
-65 — 200 °C
Maximum Change in Zener Voltage Over Current (ΔVZ)
220 mV
Maximum Surge Current (ir)
8.6 A
Maximum Zener Current (IZM)
475 mA
Power Dissipation (PD)
5 W
Reverse Voltage Leakage Current (IR)
5 µA
Storage Temperature (Tstg)
-65 — 200 °C
Zener Impedance (ZZT)
2 Ω
Zener Knee Impedance (ZZK)
125 Ω
Zener Voltage (VZ)
9.8 — 10.2 V

(10 V Typical)

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CZ5347C BK Box@500 Active 10V,5W Through-Hole Diode-Zener Single: Power Tight Tolerance EAR99 8541.10.0050 PBFREE

Resources

Analytical Test Report:Die Attach Analytical Test Report
Analytical Test Report:Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:Sn Plating Analytical Test Report
Analytical Test Report:UV Ink Analytical Test Report
CZ5333B_SERIES.PDF Device Datasheet
Material Composition:DO-201 Material Composition
Package Detail Document:DO-201 Package Detail Document
Process Change Notice:AXIAL LEAD PRODUCTS Process Change Notice
Process Change Notice:DO-201 ZENER DIODE SERIES Process Change Notice
Product Reliability Data:DO-201 Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development