Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
IF = 1 A
Test Conditions
IZ1 = 21.6 mA
IZ2 = 108 mA
Test Conditions
VR = 16.7 V
Test Conditions
IZT = 50 mA
Test Conditions
IZK = 1 mA
Test Conditions
IZT = 50 mA
(22 V Typical)
Ordering
Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
---|---|---|---|---|---|---|---|
CZ5358B BK | Box@500 | Active | 22V,5W Through-Hole Diode-Zener Single: Power | EAR99 | 8541.10.0050 | LEAD or TIN | |
CZ5358B TR | Tape & Reel@1,400 | Active | 22V,5W Through-Hole Diode-Zener Single: Power | EAR99 | 8541.10.0050 | LEAD or TIN |
Resources
Item | Type |
---|---|
No matching documents found. | |
Analytical Test Report:Die Attach | Analytical Test Report |
Analytical Test Report:Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
Analytical Test Report:Sn Plating | Analytical Test Report |
Analytical Test Report:Sn Plating | Analytical Test Report |
Analytical Test Report:UV Ink | Analytical Test Report |
CZ5333B_SERIES.PDF | Device Datasheet |
Material Composition:DO-201 | Material Composition |
Package Detail Document:DO-201 | Package Detail Document |
Process Change Notice:AXIAL LEAD PRODUCTS | Process Change Notice |
Process Change Notice:DO-201 ZENER DIODE SERIES | Process Change Notice |
Product Reliability Data:DO-201 Package Reliability | Product Reliability Data |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development