Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 15 V
f = 1 MHz
Test Conditions
VGS = 5 V
f = 1 MHz
Test Conditions
VDS = 15 V
VGS = 5 V
Test Conditions
VDS = 15 V
VGS = 5 V
TA = 150 °C
Test Conditions
f = 1 kHz
Test Conditions
ID = 3 mA
Test Conditions
VGS = 20 V
Test Conditions
VGS = 20 V
TA = 150 °C
Test Conditions
IG = 1 µA
Test Conditions
VDS = 15 V
ID = 1 nA
Test Conditions
IG = 1 mA
Test Conditions
VDS = 15 V
Test Conditions
ID = 1 mA
Test Conditions
VGS(off) = 5 V
VDD = 6 V
RL = 1.8 kΩ
ID = 3 mA
Test Conditions
ID(on) = 3 mA
VDD = 6 V
RL = 1.8 kΩ
VGS(ON) = 5 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| 2N5116 | Box@2,000 | Active | 1V,4V,50mA,500mW Through-Hole JFET P Channel | EAR99 | 8541.21.0095 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| 2N5114-5116.PDF | Device Datasheet |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Cap | Analytical Test Report |
| Analytical Test Report:Header | Analytical Test Report |
| Analytical Test Report:Header Assembly | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder | Analytical Test Report |
| Material Composition:TO-18 | Material Composition |
| Package Detail Document:TO-18 | Package Detail Document |
| Process Change Notice:HEADER TO-72 | Process Change Notice |
| Product Reliability Data:TO-18 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model 2N5116 | Spice Model |
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