Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 15 V
f = 1 MHz
Test Conditions
VDS = 15 V
f = 1 MHz
Test Conditions
VDS = 15 V
f = 1 kHz
Test Conditions
VGS = 15 V
Test Conditions
VGS = 15 V
TA = 100 °C
Test Conditions
IG = 10 µA
Test Conditions
VDS = 15 V
ID = 10 nA
Test Conditions
VDS = 15 V
f = 1 kHz
Test Conditions
VDS = 15 V
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| 2N5457 | Box@2,500 | Active | .5V,6V,10mA,310mW Through-Hole JFET N Channel | EAR99 | 8541.21.0095 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| 2N5457-5459.PDF | Device Datasheet |
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Process Change Notice:CP209->CP264V | Process Change Notice |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model 2N5457 | Spice Model |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development