Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 15 V
f = 1 kHz
Test Conditions
VDS = 15 V
f = 1 MHz
Test Conditions
VDS = 15 V
f = 1 MHz
Test Conditions
VDS = 15 V
f = 100 Hz
BW = 1 Hz
Test Conditions
VGS = 20 V
Test Conditions
VGS = 20 V
TA = 100 °C
Test Conditions
VDS = 15 V
ID = 400 µA
Test Conditions
IG = 10 µA
Test Conditions
VDS = 15 V
ID = 1 µA
Test Conditions
VDS = 15 V
f = 100 Hz
RG = 1 MΩ
BW = 1 Hz
Test Conditions
VDS = 15 V
f = 1 kHz
Test Conditions
VDS = 15 V
f = 1 kHz
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| 2N5462 | Box@2,500 | Active | 1.8V,9V,10mA,310mW Through-Hole JFET P Channel | EAR99 | 8541.21.0095 | PBFREE | |
| 2N5462 APM H | Ammo@2,000 | Active | 1.8V,9V,10mA,310mW Through-Hole JFET P Channel | EAR99 | 8541.21.0095 | PBFREE | |
| 2N5462 TRE H | Tape & Reel@2,000 | Active | 1.8V,9V,10mA,310mW Through-Hole JFET P Channel | EAR99 | 8541.21.0095 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| 2N5460-5462.PDF | Device Datasheet |
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Process Change Notice:P-CHANNEL JFETS | Process Change Notice |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |