Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 15 V
f = 1 MHz
Test Conditions
VGS = 10 V
f = 1 MHz
Test Conditions
VDS = 12 V
VGS = 10 V
Test Conditions
VDS = 12 V
VGS = 10 V
TA = 100 °C
Test Conditions
VGS = 15 V
Test Conditions
VGS = 15 V
TA = 100 °C
Test Conditions
f = 1 kHz
Test Conditions
ID = 7 mA
Test Conditions
ID(on) = 7 mA
VGS(off) = 10 V
VDD = 10 V
Test Conditions
VGS = 15 V
Test Conditions
VGS = 15 V
TA = 100 °C
Test Conditions
IG = 10 µA
Test Conditions
IG = 1 mA
Test Conditions
ID(on) = 7 mA
VGS(off) = 10 V
VDD = 10 V
Test Conditions
VDS = 15 V
Test Conditions
ID = 100 µA
Test Conditions
VDD = 10 V
VGS(off) = 10 V
ID(on) = 7 mA
Test Conditions
VDD = 10 V
VGS(off) = 10 V
ID(on) = 7 mA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| 2N5555 | Box@2,500 | Discontinued, Stock Only | 10mA,360mW Through-Hole JFET N Channel | EAR99 | 8541.21.0095 | PBFREE |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| 2N5555.PDF | Device Datasheet |
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
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| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
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| Analytical Test Report:Tin Plating | Analytical Test Report |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |
Product Support
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Design Support
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- Application and design sample kits
- Custom product and package development