BSV79

2V,7V,50mA,350mW Through-Hole JFET N Channel

Case Type: TO-18

Common Source Input Capacitance (Ciss)
5 pF
Common Source Reverse Transfer Capacitance (Crss)
10 pF
Continuous Gate Current (IG)
50 mA
Drain Current-Off (ID(OFF))
250 pA
Drain Current-Off (ID(OFF))
500 nA
Drain-Gate Voltage (VDG)
40 V
Drain-Source On Resistance (rds(ON))
40 Ω
Drain-Source On Voltage (VDS(ON))
400 mV
Drain-Source Voltage (VDS)
40 V
Gate Leakage Current (IGSS)
250 pA
Gate Leakage Current (IGSS)
500 nA
Gate Source Voltage (VGS)
1.75 — 6 V
Gate-Source Cutoff Voltage (VGS(OFF))
2 — 7 V
Gate-Source Voltage (VGS)
40 V
Junction Temperature (Tj)
-65 — 175 °C
Power Dissipation (PD)
350 mW
Saturation Drain Current (IDSS)
20 mA
Storage Temperature (Tstg)
-65 — 175 °C
Thermal Resistance Junction-Ambient (ΘJA)
430 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
BSV79 Box@2,000 Discontinued 2V,7V,50mA,350mW Through-Hole JFET N Channel EAR99 8541.21.0095 PBFREE

Resources

Analytical Test Report:Bond Wire Analytical Test Report
Analytical Test Report:Cap Analytical Test Report
Analytical Test Report:Header Analytical Test Report
Analytical Test Report:Header Assembly Analytical Test Report
Analytical Test Report:Pure Tin Solder Analytical Test Report
BSV79_80.PDF Device Datasheet
Material Composition:TO-18 Material Composition
Package Detail Document:TO-18 Package Detail Document
Product EOL Notice:JFETS Product EOL Notice
Product Reliability Data:TO-18 Package Reliability Product Reliability Data

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development