Technical Specifications
Similar Products with Selected SpecificationsTest Conditions
VDS = 20 V
f = 1 MHz
Test Conditions
VGS = 5 V
f = 1 MHz
Test Conditions
VDS = 20 V
VGS = 5 V
Test Conditions
VDS = 20 V
VGS = 5 V
TA = 100 °C
Test Conditions
f = 1 kHz
Test Conditions
ID = 3 mA
Test Conditions
VGS = 20 V
Test Conditions
VGS = 20 V
TA = 100 °C
Test Conditions
IG = 1 µA
Test Conditions
VDS = 20 V
ID = 1 nA
Test Conditions
IG = 1 mA
Test Conditions
VDS = 20 V
Test Conditions
ID = 1 mA
Test Conditions
VGS(off) = 5 V
Test Conditions
ID(on) = 3 mA
Ordering
| Part | Package | Buy | Status | Description | ECCN Code | HTS Code | Termination |
|---|---|---|---|---|---|---|---|
| CMPF4393 BK | Box@3,500 | Active | .5V,3V,50mA,350mW Surface mount JFET N Channel | EAR99 | 8541.21.0095 | PBFREE | |
| CMPF4393 TR | Tape & Reel@3,000 | Active | .5V,3V,50mA,350mW Surface mount JFET N Channel | EAR99 | 8541.21.0095 | LEAD |
Resources
| Item | Type |
|---|---|
| No matching documents found. | |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| CMPF4391-3.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CP216 REPLACES CP206 | Process Change Notice |
| Process Change Notice:CP226 REPLACE CP216 | Process Change Notice |
| Product Brief:PB JFETs | Product Brief |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMPF_4393 | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |
Product Support
Contact Product SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Supply management (Customer portals)
- Inventory bonding
- Consolidated shipping options
- Custom bar coding for shipments
- Custom product packing
Design Support
Contact Design SupportAEM stands ready to assist with your latest design endeavors as your trusted partner.
- Free quick ship samples (2nd day air)
- Online technical data and parametric search
- SPICE models
- Custom electrical curves
- Environmental regulation compliance
- Customer specific screening
- Up-screening capabilities
- Special wafer diffusions
- PbSn plating options
- Package details
- Application notes
- Application and design sample kits
- Custom product and package development