CMPF5485

.5V,4V,10mA,350mW Surface mount JFET N Channel

Case Type: SOT-23

Common Source Input Capacitance (Ciss)
5 pF
Common Source Output Capacitance (Coss)
2 pF
Common Source Power Gain (GPS)
18 — 30 dB
Common Source Power Gain (GPS)
10 — 20 dB
Common Source Reverse Transfer Capacitance (Crss)
1 pF
Continuous Drain Current (ID)
30 mA
Continuous Gate Current (IG)
10 mA
Drain-Gate Voltage (VDG)
25 V
Forward Transadmittance (gfs)
3.5 — 7 mS
Forward Transadmittance (gfs)
3 mS
Gate Leakage Current (IGSS)
1 nA
Gate Leakage Current (IGSS)
0.2 µA
Gate-Source Breakdown Voltage (BVGSS)
25 V
Gate-Source Cutoff Voltage (VGS(OFF))
0.5 — 4 V
Gate-Source Voltage (VGS)
25 V
Input Conductance (gis)
1 mS
Junction Temperature (Tj)
-65 — 150 °C
Noise Figure (NF)
2.5 dB
Noise Figure (NF)
2 dB
Noise Figure (NF)
4 dB
Output Conductance (gos)
60 µS
Output Conductance (gos)
100 µS
Power Dissipation (PD)
350 mW
Saturation Drain Current (IDSS)
4 — 10 mA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
357 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMPF5485 BK Box@3,500 Active .5V,4V,10mA,350mW Surface mount JFET N Channel EAR99 8541.21.0095 PBFREE
CMPF5485 TR Tape & Reel@3,000 Active .5V,4V,10mA,350mW Surface mount JFET N Channel EAR99 8541.21.0095 TIN

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMPF5484.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Process Change Notice:CP210->CP232V Process Change Notice
Product Brief:PB JFETs Product Brief
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:CMPF5485 Spice Model
Step File 3D Object:SOT-23 Step File 3D Object

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AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development