CMPFJ175

3V,6V,50mA,225mW Surface mount JFET P Channel

Case Type: SOT-23

Continuous Gate Current (IG)
50 mA
Drain-Gate Voltage (VDG)
30 V
Gate Leakage Current (IGSS)
1 nA
Gate-Source Breakdown Voltage (BVGSS)
30 V
Gate-Source Cutoff Voltage (VGS(OFF))
3 — 6 V
Gate-Source Voltage (VGS)
30 V
Junction Temperature (Tj)
-65 — 150 °C
Power Dissipation (PD)
225 mW
Saturation Drain Current (IDSS)
7 — 60 mA
Static Drain-Source On Resistance (rDS(ON))
125 Ω
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient (ΘJA)
556 °C/W

Ordering

Part Package Buy Status Description ECCN Code HTS Code Termination
CMPFJ175 BK Box@3,500 Active 3V,6V,50mA,225mW Surface mount JFET P Channel EAR99 8541.21.0095 PBFREE

Resources

Analytical Test Report:Copper Bond Wire Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Green Epoxy Molding Compound Analytical Test Report
Analytical Test Report:Henkel 84-1LMISR4 Analytical Test Report
CMPFJ175-176.PDF Device Datasheet
Material Composition:SOT-23 Material Composition
Package Detail Document:SOT-23 Package Detail Document
Process Change Notice:Copper Wire Bonding Process Change Notice
Process Change Notice:CP613V Replaces CP688 Process Change Notice
Product Brief:PB JFETs Product Brief
Product Reliability Data:SOT-23 Package Reliability Product Reliability Data
Spice Model:CMPFJ175 Spice Model
Step File 3D Object:SOT-23 Step File 3D Object

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Supply management (Customer portals)
  • Inventory bonding
  • Consolidated shipping options
  • Custom bar coding for shipments
  • Custom product packing

AEM stands ready to assist with your latest design endeavors as your trusted partner.

  • Free quick ship samples (2nd day air)
  • Online technical data and parametric search
  • SPICE models
  • Custom electrical curves
  • Environmental regulation compliance
  • Customer specific screening
  • Up-screening capabilities
  • Special wafer diffusions
  • PbSn plating options
  • Package details
  • Application notes
  • Application and design sample kits
  • Custom product and package development