Ruggedized

When Failure is not an option

Prevent the high cost of repairs. Engineers are increasingly experiencing failures due to high temperatures, moisture levels, corrosion, and high vibration conditions. As a leading manufacturer of high-reliability components, Central Semiconductor has developed ruggedized devices to meet the challenges of extreme environments. 

We solve these challenges by enhancing our design parameters — utilizing high-temperature die attach, gold wire bonds, and corrosion-free materials — all while maintaining industry-standard pad layouts. The result is a robust, high-reliability component that delivers superior performance in mission-critical applications.

Superior construction

The ruggedized family of semiconductors are built with the following design elements: 

• Alloy 42 copper plated lead frame
• Eutectic die attach
• 0.8 mil gold wire bond
• Silver free package
• Pb/Sn lead plating available

Initial offering

These ruggedized devices comply with both the 2011/65/EU (RoHS2) directive and 2015/863/EU (RoHS3) directive. These Transistors are In Stock at DigiKey

• BC847CW-RZ  45V, 100mA, 275mW NPN Transistor (SOT-323)
• BC857CW-RZ 45V, 100mA, 275mW PNP Transistor (SOT-323)

Additional items available

These additional ruggedized devices are available on request. Contact Central Semiconductor Sales at 631-435-1110

Applications

Ruggedized semiconductors are utilized in applications that require superior performance in challenging environments:

• Smart meters
• Downhole sensing
  • Pressure, flow, and vibration
• Avionic systems
  • Communications, actuators, and power distribution